ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,364, issued on Oct. 20, was assigned to ANRITSU Corp. (Kanagawa, Japan). "X-ray generator and X-ray inspection apparatus including the same... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,365, issued on Oct. 20, was assigned to RESEARCH INSTRUMENTS Corp. (Barrington, R.I.). "Picosecond laser-driven plasma x-ray source" was in... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,366, issued on Oct. 20, was assigned to Hamamatsu Photonics K.K. (Shizuoka, Japan) and Energetiq Technology Inc. (Wilmington, Mass.). "Indu... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,367, issued on Oct. 20, was assigned to National University Corporation Tokai National Higher Education and Research System (Nagoya, Japan).... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,368, issued on Oct. 20, was assigned to Wolfspeed Inc. (Durham, N.C.). "Thermal management enhancement of electronic components" was invent... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,369, issued on Oct. 20, was assigned to MEIKO ELECTRONICS Co. LTD. (Ayase, Japan). "Device embedded substrate and manufacturing method of s... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,370, issued on Oct. 20, was assigned to ZKW Group GmbH (Wieselburg, Austria). "Printed circuit board arrangement for a motor vehicle headli... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,371, issued on Oct. 20, was assigned to ASUSTek COMPUTER INC. (Taipei City, Taiwan). "Heat dissipation module" was invented by Po-Ting Chen... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,372, issued on Oct. 20. "Shieldable circuit board structure" was invented by Chen-Wei Su (Taipei City, Taiwan). According to the abstract*... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,373, issued on Oct. 20, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Semiconductor module and method for fabricating a s... Read More